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| Product Guide D_1112H Series, Thin Type InGaN/SiC SMT LED s Features * High brightness (InGaN/SiC) die material * Available in green (525nm), bluish-green (505nm) * and blue (470nm) colors * Wide 150 degree viewing angle * Reflow and dip soldering compatible * 1000V minimum ESD protection s Applications * Portable phone key pad backlight * Various other backlight uses s Outline Dimensions PCB Warpage direction Unit: mm Tolerances + 0.1 s Electro-Optical Characteristics Part No. Material Emitted Lens Color Color InGaN/SiC Green (Ta=25C) Wavelength Peak p TYP. Spectral Line Dominant Half Width d TYP. TYP. IF Luminous Intensity IV MIN. TYP. IF Forward Voltage VF TYP. MAX. IF Reverse Viewing Current IR Angle MAX. VR (2 1/2) DG1112H DC1112H DB1112H InGaN/SiC Bluish-Green InGaN/SiC Blue 24 Milky 24 White 8.5 40 34 14 10 10 10 mA 522 502 467 525 505 470 nm 30 30 26 10 10 10 mA 3.3 3.3 3.3 V 3.8 3.8 3.8 10 10 10 mA 100 100 100 A 5 5 5 V Deg. 150 Units mcd s Absolute Maximum Ratings Green Bluish-Green DC 76 20 48 5 -40 to +85 -40 to +100 0.28 (DC) 0.69 (Pulse) Blue (Ta=25C) Item Symbol Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Pd IF IFM VR Topr Tstg IF DG 76 20 48 5 DB 76 20 48 5 Units mW mA mA V C C mA/C * Ta=25C, IFM applies for the pulse width 1msec. and duty cycle 1/20. s Taping Specifications 1.75 + 0.1 s Operation Current Derating Chart (DC) 8+0.2 4+0.1 (1.45) 1.5 +0.1 0 (0.2) Quantity on tape: 4000 pieces per reel 2+0.05 4+0.1 13+0.2 3.5 +0.05 ( 0.5) Center Hole (2.25) (1) 2+0.5 21+0.8 DG, DC, DB, Direction to pull +1 60 -0 13+0.2 9+0.3 11.4+1 +0 180 3 s Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: * Soldering iron: Temperature at tip of iron: 280C max. (30W max.) Soldering time: 3 sec. max. * Dip soldering: Preheating: 120 ~ 150C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260C max. Dipping Time: 5 sec. max. * Reflow Soldering: LED Surface Temperature C Operation Heating 240 Temperature rise: 5C/sec. Cooling: --5C/sec. s Spatial Distribution 150 120 Pre-heating 2. Cleaning: * If cleaning is required, use the following solutions for less than 1 minute, at less than 40C. * Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. * Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGD1112H-0301 ~ 0 60 to 120 sec. 5 sec. max Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 * Tel: 800-LED-LCD1 (533-5231) * Fax: 949-222-0555 Website: www.stanley-electric.com |
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